Slitting machine has broad application prospects in the field of new materials, mainly reflected in the following aspects:

　　New energy materials processing:

　　Lithium battery materials: With the rapid development of the lithium battery industry, the slitting demand for lithium battery electrode materials continues to increase. The slitter can accurately cut the raw materials such as positive and negative electrode materials and membranes of lithium batteries into the required width and length to meet the requirements of lithium battery production. For example, in the production process of the electrode sheet, the slitting machine can ensure the dimensional accuracy and consistency of the electrode sheet, and improve the performance and production efficiency of the lithium battery. In the future, with the continuous expansion of the lithium battery market and the continuous improvement of battery performance requirements, the demand for slitting machines will also continue to grow.

　　Solar photovoltaic materials: In the field of solar photovoltaic, silicon wafers are important basic materials. The slitting machine can cut the silicon wafer to improve the utilization rate and production efficiency of the silicon wafer. At the same time, for new photovoltaic materials, such as perovskite solar cell materials, the slitting machine can also play an important role in its production process, providing support for the development of the photovoltaic industry.

　　Semiconductor material processing:

　　Wafer slitting: Semiconductor wafers are the basic materials for manufacturing integrated circuits, and the slitting accuracy of wafers is very high. The scutcher can achieve accurate wafer scutching and cut large-size wafers into small-size chips to meet the needs of semiconductor chip manufacturing. With the continuous development of the semiconductor industry, the requirements for the accuracy, speed and stability of the wafer scutcher will also continue to increase, which provides the impetus for the development of the scutcher technology.

　　Semiconductor thin film material scuttling: Semiconductor thin film materials have a wide range of applications in semiconductor devices, such as thin film transistors, light-emitting diodes, etc. The sdivider can cut the semiconductor thin film material to meet the size requirements of the device manufacturing. Moreover, with the continuous innovation and development of semiconductor thin film materials, higher requirements are also put forward for the adaptability and slitting ability of the slitting machine.

　　High performance composite material processing:

　　Carbon fiber composite material: carbon fiber composite material has the advantages of high strength, high modulus, light weight, etc., and has a wide range of applications in aerospace, automotive, sports equipment and other fields. The slitter can cut composite materials such as carbon fiber prepreg to meet the manufacturing requirements of different products. For example, in the aerospace field, the sash machine can cut carbon fiber composite materials into the shape and size required for aircraft wings, fuselages and other components, improving the utilization rate of materials and production efficiency.

　　Glass fiber composite material: glass fiber composite material is also an important high-performance composite material, the scuttling machine can be used to cut glass fiber fabric, prepreg, etc., for the manufacture of wind power blades, building materials, ships and other products. With the continuous expansion of the application of composite materials in various fields, the application prospect of slitting machine in the processing of composite materials is also broad.

　　Material processing:

　　Film scuttling: The material has unique physical, chemical and mechanical properties, and the film is an important form of the material. The scuttling machine can cut the film to meet the requirements of device manufacturing. For example, in the field of electronics, slitter machines can cut thin films into the size required for electronic components, providing support for the manufacture of electronic devices.

　　Fiber cutting: fiber has the characteristics of high specific surface area, high porosity, etc., and has a wide range of applications in filtration, adsorption, biomedicine and other fields. The slitting machine can cut the fiber material to meet the needs of different application scenarios. For example, in the manufacture of filter materials, the slitter can cut the fiber into the appropriate size, improving the filtration efficiency and performance of the filter material.

　　Biomedical materials processing:

　　Medical dressing cutting: Medical dressing is an important material for wound care, the slitter machine can cut medical dressing materials into different shapes and sizes to meet the care needs of different wounds. For example, for a large area of wound, it is necessary to use a larger size of medical dressing, and the slitting machine can cut the dressing material into a suitable size to improve the use of dressing.

　　Biodegradable material slitting: Biodegradable material is an environmentally friendly material, which has a wide range of applications in the biomedical field. The slitting machine can cut biodegradable materials to meet the manufacturing requirements of medical devices, carriers and other products. For example, in the manufacture of carriers, slitters can slice biodegradable materials into tiny particles, improving load capacity and release.